发明申请
- 专利标题： ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKING SAME
- 专利标题（中）： 电子设备基板，电子设备及其制造方法
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申请号： US12553815申请日： 2009-09-03
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公开(公告)号： US20090323299A1公开(公告)日： 2009-12-31
- 发明人: Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- 申请人： Nobuaki Miyamoto , Akira Chinda , Koki Hirasawa , Kenji Uchida
- 申请人地址： JP Tokyo JP Kanagawa
- 专利权人： HITACHI CABLE, LTD.,NEC ELECTRONICS COPORATION
- 当前专利权人： HITACHI CABLE, LTD.,NEC ELECTRONICS COPORATION
- 当前专利权人地址： JP Tokyo JP Kanagawa
- 优先权： JP2006-141862 20060522
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K3/46
摘要：
An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.
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