Invention Application
- Patent Title: Autotransformer using printed wireboard
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Application No.: US12217424Application Date: 2008-07-05
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Publication No.: US20100001824A1Publication Date: 2010-01-07
- Inventor: Keming Chen , Mike Kirkland , Michael A. Quan
- Applicant: Keming Chen , Mike Kirkland , Michael A. Quan
- Main IPC: H01F5/00
- IPC: H01F5/00

Abstract:
An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.
Public/Granted literature
- US07859381B2 Autotransformer using printed wireboard Public/Granted day:2010-12-28
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