公开(公告)号：US07859381B2

公开(公告)日：2010-12-28

申请号：US12217424

申请日：2008-07-05

申请人： Keming Chen ,  Mike Kirkland ,  Michael A. Quan

发明人： Keming Chen ,  Mike Kirkland ,  Michael A. Quan

IPC分类号： H01F5/00 ,  H01F21/04 ,  H01F21/02 ,  H01F27/28 ,  H01F27/30

CPC分类号： H01F30/02 ,  H01F27/22 ,  H01F27/2804

摘要： An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.

摘要翻译： 一种用于低频，大功率应用中的自耦变压器，其使用由顶部，内部和底部层构成的印刷线路板堆叠，其包括围绕变压器铁芯并形成在内层中的电迹线绕组，用于与热量直接热接触 水槽接口，提供均匀且一致的热通道，直到散热板。 自耦变压器还包括使用焊锡杯电连接在预定的印刷线路板迹线之间的板对板连接。 印刷线路板自耦变压器还可以使用非平面界面来与非平面散热板表面进行热界面。

公开(公告)号：US20100001824A1

公开(公告)日：2010-01-07

申请号：US12217424

申请日：2008-07-05

申请人： Keming Chen ,  Mike Kirkland ,  Michael A. Quan

发明人： Keming Chen ,  Mike Kirkland ,  Michael A. Quan

IPC分类号： H01F5/00

CPC分类号： H01F30/02 ,  H01F27/22 ,  H01F27/2804

摘要： An autotransformer for use in low frequency, high power applications that uses a stack of printed wire boards constructed of a top, inner, and bottom layer including electrical trace windings circumventing the transformer core and formed in the inner layer for direct thermal contact with a heat sink interface providing a uniform and consistent heat path down to the heat sink plate. The autotransformer further includes a board to board connection employing solder cups to electrically connect between predetermined printed wire board traces. The printed wire board autotransformer also may use a non-planar interface for thermal interface with a non-planar heat sink plate surface.

公开(公告)号：US07295440B2

公开(公告)日：2007-11-13

申请号：US11370966

申请日：2006-03-07

申请人： Evgeni Ganev ,  Robert A. Dietrich ,  Michael A. Quan

发明人： Evgeni Ganev ,  Robert A. Dietrich ,  Michael A. Quan

IPC分类号： H05K7/20

CPC分类号： H05K7/20927

摘要： An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

摘要翻译： 一体的冷板/底盘（ICPC）壳体可以由夹在其间的冷板两块材料形成，钎焊在一起。 然后可以将块加工成适合其中的电力电子设备，从而提供作为电力电子壳体的组成部分的冷板。 不同于传统的热交换器，其可以用于从通常容纳在金属板壳体中的功率耗散部件散发热量，本文所述的ICPC提供与电力电子器件壳体一体的冷板，从而允许快速且有效地去除热量 从组件进入冷板载体流体并离开系统。

公开(公告)号：US07488921B2

公开(公告)日：2009-02-10

申请号：US11364525

申请日：2006-02-27

申请人： Evgeni Ganev ,  Dennis M. Morita ,  Michael A. Quan

发明人： Evgeni Ganev ,  Dennis M. Morita ,  Michael A. Quan

IPC分类号： H05B1/02

CPC分类号： H02P1/04 ,  H02P29/68 ,  Y10T307/773

摘要： A controlled start up technique may eliminate the excessive peak junction temperature by controlling the speed of the electric device. Lower speed may result in reduced power to the load. Reduced power may result in reduced losses to maintain reliable operating junction temperatures. Once the junction reaches the predetermined temperature limit, speed may be controlled to hold the junction temperature constant. As time elapses, the coolant temperature may reduce, thereby allowing a higher power level without an increase in IGBT temperature. Unlike conventional methods which may allow for full power continuously upon start up, thereby either potentially causing a high temperature shut-down condition or requiring additional thermal inertia to handle a high heat load due to a continuous full-power start up, the controlled start up eliminates the design penalties for extensive thermal enhancements to accommodate the occasional extreme hot start up.

摘要翻译： 控制启动技术可以通过控制电气设备的速度来消除过高的峰值结温。 较低的速度可能会降低负载的功率。 降低功率可能导致损耗降低，以维持可靠的工作结温。 一旦结点达到预定的温度极限，可以控制速度以保持结温恒定。 随着时间的推移，冷却液温度可能会降低，从而允许更高的功率水平，而不会增加IGBT的温度。 不同于常规方法，可能在启动时连续地允许全功率，从而可能导致高温关闭状态或需要额外的热惯性来处理由于连续全功率启动而导致的高热负荷，受控启动 消除了对广泛热增强的设计处罚，以适应偶尔的极热启动。