发明申请
- 专利标题： Inductors for integrated circuit packages
- 专利标题（中）： 集成电路封装的电感器
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申请号： US12217293申请日： 2008-07-02
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公开(公告)号： US20100001826A1公开(公告)日： 2010-01-07
- 发明人: Donald Gardner , Gerhard Schrom , Fabrice Paillet , Shamala Chickamenahalli
- 申请人： Donald Gardner , Gerhard Schrom , Fabrice Paillet , Shamala Chickamenahalli
- 主分类号： H01F27/28
- IPC分类号： H01F27/28 ; H01F41/04
摘要：
An inductor may be formed from a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.
公开/授权文献
- US07911313B2 Inductors for integrated circuit packages 公开/授权日：2011-03-22
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