发明申请
- 专利标题： WIRE SLICING SYSTEM
- 专利标题（中）： 线切割系统
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申请号： US12499966申请日： 2009-07-09
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公开(公告)号： US20100006082A1公开(公告)日： 2010-01-14
- 发明人: Lukasz A. Glinski , David Graham , Edward L. Lambert , Krishnamoorthy Subramanian
- 申请人： Lukasz A. Glinski , David Graham , Edward L. Lambert , Krishnamoorthy Subramanian
- 申请人地址： US MA Worcester FR Conflans Sainte Honorine
- 专利权人： SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- 当前专利权人： SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- 当前专利权人地址： US MA Worcester FR Conflans Sainte Honorine
- 主分类号： B28D5/00
- IPC分类号： B28D5/00 ; B28D1/08 ; B28D1/06
摘要：
A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features.
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