发明申请
US20100006678A1 Multi-Layer Electronic Component and Method for Manufacturing the Same 有权
多层电子元件及其制造方法

  • 专利标题: Multi-Layer Electronic Component and Method for Manufacturing the Same
  • 专利标题(中): 多层电子元件及其制造方法
  • 申请号: US12095484
    申请日: 2006-11-28
  • 公开(公告)号: US20100006678A1
    公开(公告)日: 2010-01-14
  • 发明人: Masahiro Sato
  • 申请人: Masahiro Sato
  • 申请人地址: JP Kyoto-shi, Kyoto
  • 专利权人: KYOCERA CORPORATION
  • 当前专利权人: KYOCERA CORPORATION
  • 当前专利权人地址: JP Kyoto-shi, Kyoto
  • 优先权: JP2005-343492 20051129; JP2006-292384 20061027
  • 国际申请: PCT/JP2006/323715 WO 20061128
  • 主分类号: F02M51/00
  • IPC分类号: F02M51/00 H01L41/187 H01L41/24
Multi-Layer Electronic Component and Method for Manufacturing the Same
摘要:
A multi-layer electronic component that can be repetitively operated under high voltage, high temperature and high humidity is provided.The multi-layer electronic component comprises a plurality of dielectric material layers made of a sintered material having perovskite structure that includes Pb; and a plurality of internal electrodes, the dielectric material layers and the internal electrodes being stacked alternately one on another, wherein lead compound that remains in the crystal grain boundaries of the dielectric material layers is controlled so that the number of grains of the lead compound not smaller than 0.01 μm are 2 or less per 100 μm2 on average.
信息查询
0/0