发明申请
- 专利标题： Optical Clock Signal Distribution Using Through-Silicon Vias
- 专利标题（中）： 使用透硅通孔的光时钟信号分配
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申请号： US12170570申请日： 2008-07-10
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公开(公告)号： US20100008620A1公开(公告)日： 2010-01-14
- 发明人: Shih-Cheng Chang , Jin-Lien Lin , Kuo-Ching Hsu , Kai-Ming Ching , Jiun Yi Wu , Yen-Huei Chen
- 申请人： Shih-Cheng Chang , Jin-Lien Lin , Kuo-Ching Hsu , Kai-Ming Ching , Jiun Yi Wu , Yen-Huei Chen
- 主分类号： G02B6/12
- IPC分类号： G02B6/12
摘要：
An integrated circuit structure includes a semiconductor chip including a front surface and a back surface; a via extending from the back surface of the semiconductor chip into the semiconductor chip, wherein the via is light transparent; and a photon detector in the semiconductor chip and exposed to the via.
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