发明申请
- 专利标题： Microelectronic interconnect element with decreased conductor spacing
- 专利标题（中）： 具有减小导体间距的微电子互连元件
-
申请号： US12459864申请日： 2009-07-08
-
公开(公告)号： US20100009554A1公开(公告)日： 2010-01-14
- 发明人: Chang Myung Ryu , Kimitaka Endo , Belgacem Haba , Yoichi Kubota
- 申请人： Chang Myung Ryu , Kimitaka Endo , Belgacem Haba , Yoichi Kubota
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01R12/00
- IPC分类号： H01R12/00 ; H01B13/00
摘要：
A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.
公开/授权文献
信息查询
