发明申请
- 专利标题： STACKED PACKAGES AND MICROELECTRONIC ASSEMBLIES INCORPORATING THE SAME
- 专利标题（中）： 包装包装和微电子组装
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申请号： US12551807申请日： 2009-09-01
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公开(公告)号： US20100013108A1公开(公告)日： 2010-01-21
- 发明人: David Gibson , Andy Stavros
- 申请人： David Gibson , Andy Stavros
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/50
- IPC分类号： H01L23/50
摘要：
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more microelectronic devices and has top and bottom surfaces. Top unit terminals are exposed at the top surfaces and bottom unit terminals are exposed at the bottom surfaces. The top and bottom unit terminals are provided at a set of ordered column positions. Each top unit terminal of the set, except the top unit terminals at the highest ordered column position, is connected to a respective bottom unit terminal of the same unit at a next higher ordered column position. Each bottom unit terminal of the set, except the bottom unit terminals of the lowest unit in the stack, is connected to a respective upper unit terminal of the next lower unit in the stack at the same column position.
公开/授权文献
- US08704351B2 Stacked microelectronic assemblies 公开/授权日：2014-04-22
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