发明申请
- 专利标题: POROUS TITANIUM HAVING LOW CONTACT RESISTANCE
- 专利标题(中): 具有低接触电阻的多孔钛
-
申请号: US12518509申请日: 2007-12-13
-
公开(公告)号: US20100015507A1公开(公告)日: 2010-01-21
- 发明人: Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
- 申请人: Kenji Orito , Toshiharu Hayashi , Masahiro Wada , Reiko Izumi , Koji Hoshino
- 申请人地址: JP TOKYO
- 专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人: MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址: JP TOKYO
- 优先权: JP2006-335609 20061213; JP2007-292956 20071112
- 国际申请: PCT/JP2007/074038 WO 20071213
- 主分类号: H01M4/02
- IPC分类号: H01M4/02
摘要:
Porous titanium having a low contact resistance includes porous titanium body, Au, and a Ti oxide layer (3). Porous titanium includes continuous holes (1) opening on a surface and being connected to inner holes and a skeleton (2). Au adheres to at least an outer skeletal surface (4) of the porous titanium via diffusion bonding to form a network structure. The Ti oxide layer (3) is formed in a clearance between adjacent Au codes (5) of the Au network sticking. The width of an Au code (5) of the Au network is 0.3 to 10 μm at least at one position; and the thickness of the Ti oxide layer (3), which is formed in the clearance between adjacent Au codes (5) of the Au network is 30 to 150 nm.
公开/授权文献
- US07794853B2 Porous titanium having low contact resistance 公开/授权日:2010-09-14
信息查询