发明申请
- 专利标题： SUPPLY APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD
- 专利标题（中）： 供应设备，半导体制造设备和半导体制造方法
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申请号： US12405620申请日： 2009-03-17
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公开(公告)号： US20100015791A1公开(公告)日： 2010-01-21
- 发明人: Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
- 申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-187636 20080718
- 主分类号： H01L21/3205
- IPC分类号： H01L21/3205 ; B05C5/00 ; B05B7/16
摘要：
A film of uniform thickness can be formed on the entire surface of a substrate. A processing solution supply apparatus includes: a nozzle provided with a supply hole for discharging a plating solution toward a processing surface of a substrate held in a substantially horizontal direction; a temperature controller for accommodating therein the plating solution in an amount necessary for processing a preset number of substrates, for controlling a temperature of the accommodated plating solution up to a preset temperature; a heat insulator disposed between the nozzle and the temperature controller, for maintaining the plating solution, whose temperature has been controlled by the temperature controller, at the preset temperature; and a transporting mechanism for transporting the plating solution, whose temperature has been controlled up to the preset temperature by the temperature controller, toward the supply hole of the nozzle via the heat insulator.
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