Invention Application
- Patent Title: Method of manufacturing printed circuit board for optical waveguide
- Patent Title (中): 制造光波导印刷电路板的方法
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Application No.: US12285423Application Date: 2008-10-03
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Publication No.: US20100018052A1Publication Date: 2010-01-28
- Inventor: Sang Hoon Kim , Han Seo Cho , Jae Hyun Jung , Joon Sung Kim
- Applicant: Sang Hoon Kim , Han Seo Cho , Jae Hyun Jung , Joon Sung Kim
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0071868 20080723
- Main IPC: H05K3/02
- IPC: H05K3/02

Abstract:
Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask.
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