Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Patent Title (中): 半导体器件和制造方法
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Application No.: US12179217Application Date: 2008-07-24
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Publication No.: US20100019370A1Publication Date: 2010-01-28
- Inventor: Klaus Pressel , Gottfried Beer
- Applicant: Klaus Pressel , Gottfried Beer
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/28 ; H01L21/50 ; H01L21/98
Abstract:
A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.
Public/Granted literature
- US08338936B2 Semiconductor device and manufacturing method Public/Granted day:2012-12-25
Information query
IPC分类:
