Invention Application
- Patent Title: SHIELDED WIREBOND
- Patent Title (中): 屏蔽线
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Application No.: US12183483Application Date: 2008-07-31
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Publication No.: US20100025864A1Publication Date: 2010-02-04
- Inventor: Mark J. Bailey , Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson
- Applicant: Mark J. Bailey , Gerald K. Bartley , Darryl J. Becker , Paul E. Dahlen , Philip R. Germann , Andrew B. Maki , Mark O. Maxson
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L21/31
Abstract:
A wirebond interconnect structure, having ground pads and signal pads, to which wirebonds are electrically coupled, disposed on a component, is provided and includes a first coating to insulate at least the wirebonds and the signal pads with at least the ground pads exposed, and a second coating, surrounding the first coating, in electrical communication with the ground pads. The first coating is sufficiently thick to achieve a consistent characteristic impedance when the second coating is applied.
Information query
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