发明申请
- 专利标题: SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体芯片和半导体器件
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申请号: US12531819申请日: 2008-05-09
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公开(公告)号: US20100032832A1公开(公告)日: 2010-02-11
- 发明人: Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa , Teppei Iwase
- 申请人: Yoshihiro Tomura , Kazuhiro Nobori , Yuichiro Yamada , Kentaro Kumazawa , Teppei Iwase
- 申请人地址: JP Kadoma-shi, Osaka
- 专利权人: PANASONIC CORPORATION
- 当前专利权人: PANASONIC CORPORATION
- 当前专利权人地址: JP Kadoma-shi, Osaka
- 优先权: JP2007-126173 20070511
- 国际申请: PCT/JP2008/001166 WO 20080509
- 主分类号: H01L23/488
- IPC分类号: H01L23/488
摘要:
In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
公开/授权文献
- US07994638B2 Semiconductor chip and semiconductor device 公开/授权日:2011-08-09