发明申请
- 专利标题： METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
- 专利标题（中）： 通过一体化的线接触后端的方法
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申请号： US12613518申请日： 2009-11-05
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公开(公告)号： US20100044867A1公开(公告)日： 2010-02-25
- 发明人: John Boyd , Fritz Redeker , Yezdi Dordi , Hyungsuk Alexander Yoon , Shijian Li
- 申请人： John Boyd , Fritz Redeker , Yezdi Dordi , Hyungsuk Alexander Yoon , Shijian Li
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/768
摘要：
Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention.
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