发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM FLIP CHIP
- 专利标题（中）： 集成电路封装系统FLIP芯片
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申请号： US12194507申请日： 2008-08-19
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公开(公告)号： US20100044882A1公开(公告)日： 2010-02-25
- 发明人: SooMoon Park , KyungHoon Lee
- 申请人： SooMoon Park , KyungHoon Lee
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect; forming a bump ring on the substrate, the bump ring having an inner cavity area over the trace conductor and an outer bump area; applying a substrate mask layer adjacent a perimeter of the outer bump area; connecting a device to the trace conductor below the bump ring; and applying a compound between the device and the substrate.
公开/授权文献
- US08143096B2 Integrated circuit package system flip chip 公开/授权日：2012-03-27
信息查询
IPC分类:
