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发明申请
US20100044890A1 SEMICONDUCTOR SUBSTRATE MANUFACTURE APPARATUS, SEMICONDUCTOR SUBSTRATE MANUFACTURE METHOD, AND SEMICONDUCTOR SUBSTRATE 审中-公开
半导体基板制造设备，半导体基板制造方法和半导体基板

SEMICONDUCTOR SUBSTRATE MANUFACTURE APPARATUS, SEMICONDUCTOR SUBSTRATE MANUFACTURE METHOD, AND SEMICONDUCTOR SUBSTRATE
摘要：
[Problems] To perform predetermined processing such as annealing and coating application of a semiconductor material with high accuracy on a number of semiconductor formation areas formed over a wide region on a surface of a substrate having elasticity such as a plastic substrate even when the substrate expands and contracts.[Solving Means] A semiconductor substrate manufacture apparatus includes: a tracking device (33) having a light-emitting portion (34) which applies light to a substrate surface during tracking, a light-receiving portion (35) which receives the light applied by the light-emitting portion (34) and reflected by the substrate surface, and a position detecting portion (36) which detects the positions of the semiconductor formation areas on the substrate based on the spectrum or intensity of the received light; and a semiconductor processing device for performing the predetermined processing on each of the semiconductor formation areas based on position information from the tracking device (33). For example, an annealing light application device (37) or an inkjet nozzle (41) is used as the semiconductor processing device.
摘要（中）：

[问题]即使当基板膨胀时，也可以在诸如塑料基板的具有弹性的基板的表面上在宽范围上形成的多个半导体形成区域上高精度地退火和涂覆半导体材料的预定处理 和合同。 【解决方案】半导体衬底制造装置包括：跟踪装置（33），其具有在跟踪期间向衬底表面施加光的发光部（34）;受光部（35），其接收由 发光部分（34）并被基板表面反射;以及位置检测部分（36），其基于所接收的光的光谱或强度来检测基板上的半导体形成区域的位置; 以及半导体处理装置，用于基于来自跟踪装置（33）的位置信息对每个半导体形成区域执行预定处理。 例如，使用退火光施加装置（37）或喷墨喷嘴（41）作为半导体处理装置。

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