Invention Application
US20100047458A1 PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME
有权
PADADIUM复合物和催化剂 - 加工处理方法
- Patent Title: PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME
- Patent Title (中): PADADIUM复合物和催化剂 - 加工处理方法
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Application No.: US12096027Application Date: 2006-11-02
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Publication No.: US20100047458A1Publication Date: 2010-02-25
- Inventor: Makoto Kohtoku , Mika Hamada
- Applicant: Makoto Kohtoku , Mika Hamada
- Applicant Address: JP Taito-ku
- Assignee: EBARA-UDYLITE CO., LTD.
- Current Assignee: EBARA-UDYLITE CO., LTD.
- Current Assignee Address: JP Taito-ku
- Priority: JP2005-351998 20051206
- International Application: PCT/JP2006/321941 WO 20061102
- Main IPC: B05D3/10
- IPC: B05D3/10 ; C07F15/00 ; C23C16/18 ; C25D5/56

Abstract:
There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
Public/Granted literature
- US08354014B2 Palladium complex and catalyst-imparting treatment solution using the same Public/Granted day:2013-01-15
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