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1.发明授权公开(公告)号：US08354014B2
公开(公告)日：2013-01-15
申请号：US12096027
申请日：2006-11-02
Applicant: Makoto Kohtoku , Mika Hamada
Inventor： Makoto Kohtoku , Mika Hamada
CPC classification number: B01J37/0215 , B01J23/44 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30
Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
Abstract translation: 提供了选择性地将催化剂金属吸附到阴离子基团如羧基上的技术，从而选择性地在非导电树脂上形成金属膜，包括由下式（I）表示的钯络合物：其中L表示亚烷基 R表示氨基或胍基，或其结构异构体，含有复合物作为活性成分的化学镀催化剂用处理液，以及在非导电性树脂上形成金属电镀膜的方法， 具有表面阴离子基团的非导电树脂，使用该处理溶液进行催化剂吸附处理，然后进行还原处理，化学镀金属和金属电镀。
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公开(公告)号：US10021789B2
公开(公告)日：2018-07-10
申请号：US12666872
申请日：2008-06-26
Applicant: Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
Inventor： Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
IPC: B32B15/08 , C23C18/22 , C23C18/32 , H05K3/38 , C23C18/16 , C23C18/20 , H05K3/18 , B32B15/20 , B32B27/28 , C23C18/30 , H05K1/03
CPC classification number: H05K3/381 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/204 , B32B2307/306 , B32B2307/712 , B32B2307/714 , B32B2457/00 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/181 , H05K2201/0154 , H05K2203/0793 , Y10T428/2495 , Y10T428/31681
Abstract: An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprises a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.
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公开(公告)号：US20100189974A1
公开(公告)日：2010-07-29
申请号：US12666872
申请日：2008-06-26
Applicant: Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
Inventor： Shinya Ochi , Ryuichi Nakagami , Makoto Kohtoku , Mika Hamada
CPC classification number: H05K3/381 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2307/204 , B32B2307/306 , B32B2307/712 , B32B2307/714 , B32B2457/00 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/32 , H05K1/0346 , H05K3/181 , H05K2201/0154 , H05K2203/0793 , Y10T428/2495 , Y10T428/31681
Abstract: An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer.A laminated polyimide substrate comprising a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.
Abstract translation: 本发明的目的是提供一种叠层聚酰亚胺基板及其制造方法，其中通过在严格条件下有效地控制随时间的变化来确保和/或提供各种性能，同时确保聚酰亚胺膜和金属层之间的充分粘合。 一种层叠聚酰亚胺基板，其包含聚酰亚胺层，由聚酰亚胺层衍生的碱处理层和金属层，其中碱处理层含有阴离子官能团，并且是具有层 含有布置在金属层侧的金属催化剂和含有布置在聚酰亚胺层侧上的金属催化剂的络合物的层。
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4.发明申请PALLADIUM COMPLEX AND CATALYST-IMPARTING TREATMENT SOLUTION USING THE SAME 有权PADADIUM复合物和催化剂 - 加工处理方法公开(公告)号：US20100047458A1
公开(公告)日：2010-02-25
申请号：US12096027
申请日：2006-11-02
Applicant: Makoto Kohtoku , Mika Hamada
Inventor： Makoto Kohtoku , Mika Hamada
CPC classification number: B01J37/0215 , B01J23/44 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30
Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
Abstract translation: 提供了选择性地将催化剂金属吸附到阴离子基团如羧基上的技术，从而选择性地在非导电树脂上形成金属膜，包括由下式（I）表示的钯络合物：其中L表示亚烷基 R表示氨基或胍基，或其结构异构体，含有复合物作为活性成分的化学镀催化剂用处理液，以及在非导电性树脂上形成金属电镀膜的方法， 具有表面阴离子基团的非导电树脂，使用该处理溶液进行催化剂吸附处理，然后进行还原处理，化学镀金属和金属电镀。
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