Invention Application
- Patent Title: TRANSIENT LIQUID PHASE EUTECTIC BONDING
- Patent Title (中): 瞬态液相保护接合
-
Application No.: US12607456Application Date: 2009-10-28
-
Publication No.: US20100047491A1Publication Date: 2010-02-25
- Inventor: Odd Harald Steen Eriksen , Shuwen Guo , Kimiko J. Childress
- Applicant: Odd Harald Steen Eriksen , Shuwen Guo , Kimiko J. Childress
- Applicant Address: US MN Burnsville
- Assignee: ROSEMOUNT AEROSPACE INC.
- Current Assignee: ROSEMOUNT AEROSPACE INC.
- Current Assignee Address: US MN Burnsville
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B9/00
Abstract:
A structure including a first structural component, a second structural component and a bonding structure bonding the first and second structural components together, where the bonding structure contains a hypoeutectic solid solution alloy. The hypoeutectic solid solution alloy may be a gold-germanium solid solution alloy, a gold-silicon solid solution alloy or a gold-tin solid solution alloy.
Information query
