发明申请
- 专利标题： HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF
- 专利标题（中）： 大功率LED封装及其制造方法
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申请号： US12612268申请日： 2009-11-04
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公开(公告)号： US20100047941A1公开(公告)日： 2010-02-25
- 发明人: Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yoen Han , Dae Yeon Kim , Young Sam Park
- 申请人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yoen Han , Dae Yeon Kim , Young Sam Park
- 申请人地址： KR Kyungki-do
- 专利权人： SAMSUNG ELECTO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Kyungki-do
- 优先权： KR10-2005-0047782 20050603
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
公开/授权文献
- US07875476B2 High power LED package and fabrication method thereof 公开/授权日：2011-01-25
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