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    Method for preparing wholly aromatic liquid crystalline polyester amide resin and method for preparing wholly aromatic liquid crystalline polyester amide resin compound
    1.
    发明授权
    Method for preparing wholly aromatic liquid crystalline polyester amide resin and method for preparing wholly aromatic liquid crystalline polyester amide resin compound 有权
    全芳族液晶聚酯酰胺树脂的制备方法和全芳香族液晶聚酯酰胺树脂化合物的制备方法

    公开(公告)号：US08859711B2

    公开(公告)日：2014-10-14

    申请号：US13884723

    申请日：2011-10-21

    申请人： Sun Hwa Chang ,  Sang Mi Kang ,  Dae Yeon Kim

    发明人： Sun Hwa Chang ,  Sang Mi Kang ,  Dae Yeon Kim

    IPC分类号： C08G64/00 ,  C09K19/38 ,  C08L77/12 ,  C08G69/44 ,  C08G63/02

    CPC分类号： C09K19/3809 ,  C08G69/44 ,  C08L77/12

    摘要： A method of preparing a wholly aromatic liquid crystalline polyester amide resin and a method of preparing a wholly aromatic liquid crystalline polyester amide resin compound. The method of preparing a wholly aromatic liquid crystalline polyester amide resin is performed using a monomer having both a hydroxyl group and an acetylamino group or using a monomer having a hydroxyl group and a monomer having an acetylamino group. In addition, the method of preparing a wholly aromatic liquid crystalline polyester amide resin compound is performed using a wholly aromatic liquid crystalline polyester amide resin that is prepared using the method.

    摘要翻译： 一种制备全芳族液晶聚酯酰胺树脂的方法和一种制备全芳族液晶聚酯酰胺树脂化合物的方法。 制备全芳族液晶聚酯酰胺树脂的方法使用具有羟基和乙酰氨基的单体或使用具有羟基的单体和具有乙酰氨基的单体进行。 此外，使用使用该方法制备的全芳族液晶聚酯酰胺树脂进行全芳香族液晶聚酯酰胺树脂化合物的制备方法。

    LED package and backlight unit using the same
    2.
    发明授权
    LED package and backlight unit using the same 有权
    LED封装和背光单元使用相同

    公开(公告)号：US08197090B2

    公开(公告)日：2012-06-12

    申请号：US12832469

    申请日：2010-07-08

    申请人： Dae Yeon Kim ,  Young Sam Park

    发明人： Dae Yeon Kim ,  Young Sam Park

    IPC分类号： F21V5/04

    CPC分类号： H01L33/58 ,  H01L33/46

    摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

    摘要翻译： 本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

    LED package
    4.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US08105854B2

    公开(公告)日：2012-01-31

    申请号：US12612334

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

    摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

    摘要翻译： 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。

    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
    发光二极管封装及其制造方法

    公开(公告)号：US20110031526A1

    公开(公告)日：2011-02-10

    申请号：US12907348

    申请日：2010-10-19

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Method of and apparatus for lossless video encoding and decoding
    9.
    发明授权
    Method of and apparatus for lossless video encoding and decoding 失效
    无损视频编码和解码的方法和装置

    公开(公告)号：US07738714B2

    公开(公告)日：2010-06-15

    申请号：US11516603

    申请日：2006-09-07

    申请人： Yung-lyul Lee ,  Dae-yeon Kim ,  Ki-hun Han ,  Jae-ho Hur

    发明人： Yung-lyul Lee ,  Dae-yeon Kim ,  Ki-hun Han ,  Jae-ho Hur

    IPC分类号： G06K9/36

    CPC分类号： H04N19/12 ,  H04N19/147 ,  H04N19/176 ,  H04N19/593 ,  H04N19/61

    摘要： Provided are a method of and apparatus for lossless video encoding and decoding, in which a differential residual block generated by calculating a difference between pixels of a residual block resulting from interprediction is encoded, thereby improving the compression rate. The method of lossless video encoding includes performing interprediction between a reference frame and a current frame in units of a predetermined-size block to generate a predicted block of a current block to be encoded, generating a residual block composed of residual signals corresponding to differences between pixels of the predicted block and the current block, calculating differences between the residual signals of the residual block in a predetermined direction and generating a differential residual block based on the calculated differences, and performing entropy-encoding on the differential residual block.

    摘要翻译： 提供了一种用于无损视频编码和解码的方法和装置，其中通过计算由间隔预测产生的残差块的像素之间的差异而产生的差分残差块被编码，从而提高了压缩率。 无损视频编码的方法包括以预定大小的块为单位执行参考帧和当前帧之间的间隔预测，以产生要编码的当前块的预测块，产生由对应于 计算预测块和当前块的像素，计算在预定方向上的残差块的残差信号之间的差异，并基于计算的差产生差分残差块，并对差分残差块进行熵编码。

    High power LED package and fabrication method thereof
    10.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07626250B2

    公开(公告)日：2009-12-01

    申请号：US11445227

    申请日：2006-06-02

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。