Invention Application
- Patent Title: CHIP PACKAGE MODULE HEAT SINK
- Patent Title (中): 芯片封装模块散热片
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Application No.: US12615159Application Date: 2009-11-09
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Publication No.: US20100055843A1Publication Date: 2010-03-04
- Inventor: Chien-Hung Liu
- Applicant: Chien-Hung Liu
- Applicant Address: TW Taoyuan Hsien
- Assignee: XINTEC, INC.
- Current Assignee: XINTEC, INC.
- Current Assignee Address: TW Taoyuan Hsien
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A heat sink mechanism including multiple heat passages in the base of a casing of a chip package module penetrating through a substrate packed in the module; a metal material being deposited in each heat passage to become a heat sink conductor connecting the substrate and the surface of the casing to effectively solve the problem of excessive heat generated in the course of HF operation of the chip package module thus to prevent chip failure.
Information query
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