发明申请
- 专利标题： Inspection of underfill in integrated circuit package
- 专利标题（中）： 检查集成电路封装中的底部填充物
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申请号： US12587627申请日： 2009-10-09
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公开(公告)号： US20100055848A1公开(公告)日： 2010-03-04
- 发明人: Keng Sang Cha , Tek Seng Tan , Haris Fazelah , Ahmad Zahrain B. Mohamad Shakir
- 申请人： Keng Sang Cha , Tek Seng Tan , Haris Fazelah , Ahmad Zahrain B. Mohamad Shakir
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/66 ; B23K3/00
摘要：
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material.
信息查询
IPC分类:
