发明申请
- 专利标题: Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus
- 专利标题(中): 微结构装置及微结构装置制造方法
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申请号: US12530182申请日: 2008-03-05
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公开(公告)号: US20100059244A1公开(公告)日: 2010-03-11
- 发明人: Itaru Ishii
- 申请人: Itaru Ishii
- 申请人地址: JP Kyoto-shi, Kyoto
- 专利权人: KYOCERA CORPORATION
- 当前专利权人: KYOCERA CORPORATION
- 当前专利权人地址: JP Kyoto-shi, Kyoto
- 优先权: JP2007-054569 20070305; JP2007-255338 20070928
- 国际申请: PCT/JP2008/053976 WO 20080305
- 主分类号: H05K5/06
- IPC分类号: H05K5/06
摘要:
The invention relates to a microstructure apparatus. A microstructure apparatus according to one of the invention includes a first substrate having a surface on which a microstructure is disposed; a second substrate having a surface opposing the microstructure; and a sealing member that bonds the opposing surfaces of the first substrate and the second substrate and that encloses and seals the microstructure. The sealing member includes a brazing metal containing a filler.