发明申请
- 专利标题： Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus
- 专利标题（中）： 微结构装置及微结构装置制造方法
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申请号： US12530182申请日： 2008-03-05
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公开(公告)号： US20100059244A1公开(公告)日： 2010-03-11
- 发明人: Itaru Ishii
- 申请人： Itaru Ishii
- 申请人地址： JP Kyoto-shi, Kyoto
- 专利权人： KYOCERA CORPORATION
- 当前专利权人： KYOCERA CORPORATION
- 当前专利权人地址： JP Kyoto-shi, Kyoto
- 优先权： JP2007-054569 20070305; JP2007-255338 20070928
- 国际申请： PCT/JP2008/053976 WO 20080305
- 主分类号： H05K5/06
- IPC分类号： H05K5/06
摘要：
The invention relates to a microstructure apparatus. A microstructure apparatus according to one of the invention includes a first substrate having a surface on which a microstructure is disposed; a second substrate having a surface opposing the microstructure; and a sealing member that bonds the opposing surfaces of the first substrate and the second substrate and that encloses and seals the microstructure. The sealing member includes a brazing metal containing a filler.