发明申请
- 专利标题: COMPOSIT METALLIC THIN FILMY PARTICLE, DISPERSION OF A COMPOSIT METALLIC THIN FILMY PARTICLE, INK FOR MAKING A CONDUCTIVE SUBSTRATE, METHOD FOR MAKING A CONDUCTIVE SUBSTRATE AND A CONDUCTIVE SUBSTRATE
- 专利标题(中): 组合物金属薄膜,组分金属薄膜颗粒,用于制造导电基材的油墨的分散,用于制造导电基板和导电基板的方法
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申请号: US12546117申请日: 2009-08-24
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公开(公告)号: US20100059260A1公开(公告)日: 2010-03-11
- 发明人: Kiyohiko Takemoto , Miharu Kanaya
- 申请人: Kiyohiko Takemoto , Miharu Kanaya
- 申请人地址: JP Tokyo
- 专利权人: SEIKO EPSON CORPORATION
- 当前专利权人: SEIKO EPSON CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-213642 20080822
- 主分类号: H05K1/09
- IPC分类号: H05K1/09 ; B05D5/12 ; H01B1/22
摘要:
Objects of the present invention include providing composite metallic thin filmy particles for conductive inks and a conductive ink, both allowing the production of highly conductive substrates with simpler equipment and at a lower cost, providing a method for making such a conductive substrate, and providing such a conductive substrate.The present invention includes Step 1 for coating a surface of a base material sheet with a composite metallic thin film layer that contains at least one of a resin layer and a wax layer and at least one of a metal layer and a metal compound layer and Step 2 for removing the composite metallic thin film layer from the sheet. The resultant composite metallic thin filmy particles and conductive ink can be used in a conductive substrate producing apparatus, formed into a pattern on the conductive substrate by screen printing, an ink jet method, or some other liquid-based process.
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