发明申请
- 专利标题： REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
- 专利标题（中）： 反应性单体和含有相同的树脂组合物
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申请号： US11993457申请日： 2006-06-20
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公开(公告)号： US20100059261A1公开(公告)日： 2010-03-11
- 发明人: Hisashi Watanabe , Kenji Nakajima , Keizo Tanaka , Satoru Nanba
- 申请人： Hisashi Watanabe , Kenji Nakajima , Keizo Tanaka , Satoru Nanba
- 申请人地址： JP Yokkaichi-shi, Mie JP Fukuyama-shi, Hiroshima
- 专利权人： AMT LABORATORY CO., LTD.,MANAC INC.
- 当前专利权人： AMT LABORATORY CO., LTD.,MANAC INC.
- 当前专利权人地址： JP Yokkaichi-shi, Mie JP Fukuyama-shi, Hiroshima
- 优先权： JP2005-179773 20050620
- 国际申请： PCT/JP2006/312270 WO 20060620
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; C07D209/48 ; C07D307/77 ; C08K5/3447 ; B32B15/08 ; B32B27/18 ; B32B27/36
摘要：
A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): wherein one of X and Y represents O and the other represents NAr2R2, and R1, R2, Ar1, and Ar2 are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.