发明申请
- 专利标题： Mulit-layer embedded capacitance and resistance substrate core
- 专利标题（中）： 多层嵌入式电容和电阻基板芯
-
申请号： US12283146申请日： 2008-09-09
-
公开(公告)号： US20100060381A1公开(公告)日： 2010-03-11
- 发明人: Rabindra N. Das , John M. Lauffer , Irving Memis , Steven G. Rosser
- 申请人： Rabindra N. Das , John M. Lauffer , Irving Memis , Steven G. Rosser
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 主分类号： H03H7/00
- IPC分类号： H03H7/00 ; H05K3/30
摘要：
A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
公开/授权文献
信息查询
