发明申请
US20100073531A1 OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD FOR MANUFACTURING OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT WAFER MODULE, METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MODULE, ELECTRONIC ELEMENT MODULE AND ELECTRONIC INFORMATION DEVICE
有权
光学元件，光学元件波长，光学元件波长模块，光学元件模块，制造光学元件模块的方法，电子元件波形模块，制造电子元件模块的方法，电子元件模块和电子信息装置
- 专利标题： OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD FOR MANUFACTURING OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT WAFER MODULE, METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MODULE, ELECTRONIC ELEMENT MODULE AND ELECTRONIC INFORMATION DEVICE
- 专利标题（中）： 光学元件，光学元件波长，光学元件波长模块，光学元件模块，制造光学元件模块的方法，电子元件波形模块，制造电子元件模块的方法，电子元件模块和电子信息装置
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申请号： US12565444申请日： 2009-09-23
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公开(公告)号： US20100073531A1公开(公告)日： 2010-03-25
- 发明人: Yuji Yano , Norimichi Shigemitsu , Kengo Iwai
- 申请人： Yuji Yano , Norimichi Shigemitsu , Kengo Iwai
- 申请人地址： JP Osaka
- 专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人地址： JP Osaka
- 优先权： JP2008-246971 20080925; JP2009-199024 20090828
- 主分类号： H04N5/335
- IPC分类号： H04N5/335 ; G02B7/00 ; B32B38/10 ; F21V7/00 ; B26D3/08
摘要：
An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating a portion corresponding to the optical surface, provided inside a transparent resin material, wherein the support plate has light shielding characteristics, an outer circumference portion side of the through hole of the support plate is provided inside the spacer section, and the outer circumference portion side of the through hole is configured to be thicker than a further outer circumference portion side thereof.