In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.