发明申请
- 专利标题： Method of forming wiring board and wiring board obtained
- 专利标题（中）： 形成接线板和接线板的方法
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申请号： US12585754申请日： 2009-09-24
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公开(公告)号： US20100078208A1公开(公告)日： 2010-04-01
- 发明人: Seiichi Inoue
- 申请人： Seiichi Inoue
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-252775 20080930
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/10
摘要：
A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.
公开/授权文献
- US08378227B2 Method of forming wiring board and wiring board obtained 公开/授权日：2013-02-19
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