Invention Application
- Patent Title: Method of forming wiring board and wiring board obtained
- Patent Title (中): 形成接线板和接线板的方法
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Application No.: US12585884Application Date: 2009-09-28
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Publication No.: US20100078209A1Publication Date: 2010-04-01
- Inventor: Seiichi Inoue
- Applicant: Seiichi Inoue
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2008-253284 20080930
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/10
Abstract:
A method of forming a wiring board comprises: a step of forming conductive metallic portions in a desired conductive pattern by ejecting for drawing a colloidal metal solution on a substrate by an ink-jet system based on image date of the conductive pattern; and a step of performing wet heating on the substrate having the conductive metallic portions formed thereon.
Information query
