发明申请
- 专利标题： On-Chip RF Shields with Front Side Redistribution Lines
- 专利标题（中）： 带前端再分配线的片上RF屏蔽
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申请号： US12242688申请日： 2008-09-30
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公开(公告)号： US20100078778A1公开(公告)日： 2010-04-01
- 发明人: Hans-Joachim Barth , Thorsten Meyer , Markus Brunnbauer , Snezana Jenei
- 申请人： Hans-Joachim Barth , Thorsten Meyer , Markus Brunnbauer , Snezana Jenei
- 主分类号： H01L23/552
- IPC分类号： H01L23/552 ; H01L21/44 ; H01L21/56
摘要：
A system on chip comprising a RF shield is disclosed. In one embodiment, the system on chip includes a RF component disposed on a chip, first redistribution lines disposed above the system on chip, the first redistribution lines coupled to I/O connection nodes. The system on chip further includes second redistribution lines disposed above the RF component, the second redistribution lines coupled to ground potential nodes. The second redistribution lines include a first set of parallel metal lines coupled together by a second set of parallel metal lines.
公开/授权文献
- US08178953B2 On-chip RF shields with front side redistribution lines 公开/授权日：2012-05-15
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