发明申请
- 专利标题： Semiconductor Device
- 专利标题（中）： 半导体器件
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申请号： US12238468申请日： 2008-09-26
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公开(公告)号： US20100078796A1公开(公告)日： 2010-04-01
- 发明人: Stefan PAULUS , Manfred FRIES , Martin PETZ , Thomas Mueller
- 申请人： Stefan PAULUS , Manfred FRIES , Martin PETZ , Thomas Mueller
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/02
摘要：
This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.
公开/授权文献
- US07868430B2 Semiconductor device 公开/授权日：2011-01-11
信息查询
IPC分类:
