Invention Application
US20100078879A1 APPARATUS FOR ALTERING THE ORIENTATION AND/OR DIRECTION OF SHEET MATERIAL IN MAILPIECE FABRICATION SYSTEMS
有权
改变MAILPIECE制造系统中材料的方向和/或方向的装置
- Patent Title: APPARATUS FOR ALTERING THE ORIENTATION AND/OR DIRECTION OF SHEET MATERIAL IN MAILPIECE FABRICATION SYSTEMS
- Patent Title (中): 改变MAILPIECE制造系统中材料的方向和/或方向的装置
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Application No.: US12241470Application Date: 2008-09-30
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Publication No.: US20100078879A1Publication Date: 2010-04-01
- Inventor: Karel J. Janatka , Joseph A. Trudeau , Edward M. Ifkovits , Russell W. Holbrook
- Applicant: Karel J. Janatka , Joseph A. Trudeau , Edward M. Ifkovits , Russell W. Holbrook
- Applicant Address: US CT Stamford
- Assignee: Pitney Bowes Inc.
- Current Assignee: Pitney Bowes Inc.
- Current Assignee Address: US CT Stamford
- Main IPC: B65H9/00
- IPC: B65H9/00

Abstract:
An apparatus is provided for altering the spatial orientation and/or direction of sheet material. The apparatus includes an input deck for receiving sheet material along an input feed path, an output deck for forwarding sheet material along an output feed path, and an orbit nip roller assembly disposed adjacent to and aligned with the input and output decks. The orbit nip roller assembly includes a primary and secondary roller defining a roller nip which lies substantially parallel to the input and output feed paths. The secondary roller is adapted to be bi-directionally displaced in an arc about the periphery of the primary roller such that the roller nip orbits the primary roller from a first radial position to a second radial position. In the first radial position, the roller nip is adapted to accept sheet material from the input deck at a substantially right angle relative to the input feed path and, in the second radial position, the roller nip is adapted to dispense sheet material to the output deck at a substantially right angle relative to the output feed path.
Public/Granted literature
- US07841594B2 Apparatus for altering the orientation and/or direction of sheet material in mailpiece fabrication systems Public/Granted day:2010-11-30
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