发明申请
- 专利标题： Package and fabricating method thereof
- 专利标题（中）： 包装及其制造方法
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申请号： US12285346申请日： 2008-10-02
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公开(公告)号： US20100084749A1公开(公告)日： 2010-04-08
- 发明人: Young-Moon Hong , Chang-Suk Han , Chang-Won Park
- 申请人： Young-Moon Hong , Chang-Suk Han , Chang-Won Park
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/56
摘要：
A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant.
公开/授权文献
- US08008784B2 Package including a lead frame, a chip and a sealant 公开/授权日：2011-08-30
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