LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20090291519A1

    公开(公告)日:2009-11-26

    申请号:US12535244

    申请日:2009-08-04

    IPC分类号: H01L33/00

    摘要: Disclosed herein is a light emitting device. The light emitting device includes an n-type nitride semiconductor layer; an active layer on the n-type semiconductor layer, an AlN/GaN layer of a super lattice structure formed by alternately growing an AlN layer and a GaN layer on the active layer, and a p-type nitride semiconductor layer on the AlN/GaN layer of the super lattice structure. At least one of the AlN layer and the GaN layer is doped with a p-type dopant. A method for manufacturing the light emitting device is also provided.

    摘要翻译: 本文公开了一种发光器件。 发光器件包括n型氮化物半导体层; 在n型半导体层上的有源层,通过在有源层上交替生长AlN层和GaN层而形成的超晶格结构的AlN / GaN层和AlN / GaN上的p型氮化物半导体层 层的超晶格结构。 AlN层和GaN层中的至少一个掺杂有p型掺杂剂。 还提供了一种用于制造发光器件的方法。

    Package and fabricating method thereof
    5.
    发明申请
    Package and fabricating method thereof 有权
    包装及其制造方法

    公开(公告)号:US20100084749A1

    公开(公告)日:2010-04-08

    申请号:US12285346

    申请日:2008-10-02

    IPC分类号: H01L23/495 H01L21/56

    摘要: A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant.

    摘要翻译: 提供了一种封装及其制造方法。 封装包括引线框架,芯片和密封剂。 引线框架具有凹口和多个第一切口侧引线,多个第一切口侧焊盘,多个第二切口侧引线和多个第二切口侧焊盘。 第一缺口侧引线延伸到凹口的第一侧。 第一切口侧焊盘相应地设置在第一切口侧引线上。 第二缺口侧引线延伸到凹口的第二侧。 第二切口侧焊盘相应地设置在第二切口侧引线上。 密封剂密封芯片和引线框架并暴露引线框架的下表面。 切口露出一部分密封剂。

    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20100216272A1

    公开(公告)日:2010-08-26

    申请号:US12775119

    申请日:2010-05-06

    IPC分类号: H01L21/20

    摘要: Disclosed herein is a light emitting device. The light emitting device includes an n-type nitride semiconductor layer; an active layer on the n-type semiconductor layer, an AlN/GaN layer of a super lattice structure formed by alternately growing an AlN layer and a GaN layer on the active layer, and a p-type nitride semiconductor layer on the AlN/GaN layer of the super lattice structure. At least one of the AlN layer and the GaN layer is doped with a p-type dopant. A method for manufacturing the light emitting device is also provided.

    摘要翻译: 本文公开了一种发光器件。 发光器件包括n型氮化物半导体层; 在n型半导体层上的有源层,通过在有源层上交替生长AlN层和GaN层而形成的超晶格结构的AlN / GaN层和AlN / GaN上的p型氮化物半导体层 层的超晶格结构。 AlN层和GaN层中的至少一个掺杂有p型掺杂剂。 还提供了一种用于制造发光器件的方法。

    Light emitting device and method for manufacturing the same
    10.
    发明授权
    Light emitting device and method for manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US08716048B2

    公开(公告)日:2014-05-06

    申请号:US12775119

    申请日:2010-05-06

    IPC分类号: H01L21/00

    摘要: Disclosed herein is a light emitting device. The light emitting device includes an n-type nitride semiconductor layer; an active layer on the n-type semiconductor layer, an AlN/GaN layer of a super lattice structure formed by alternately growing an AlN layer and a GaN layer on the active layer, and a p-type nitride semiconductor layer on the AlN/GaN layer of the super lattice structure. At least one of the AlN layer and the GaN layer is doped with a p-type dopant. A method for manufacturing the light emitting device is also provided.

    摘要翻译: 本文公开了一种发光器件。 发光器件包括n型氮化物半导体层; 在n型半导体层上的有源层,通过在有源层上交替生长AlN层和GaN层而形成的超晶格结构的AlN / GaN层和AlN / GaN上的p型氮化物半导体层 层的超晶格结构。 AlN层和GaN层中的至少一个掺杂有p型掺杂剂。 还提供了一种用于制造发光器件的方法。