LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME

Invention Application

US20100090245A1 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME 失效

Title translation: 发光二极管封装及其制造方法

Please log in to see more content

Patent Title: LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
Patent Title (中): 发光二极管封装及其制造方法
Application No.: US12481549

Application Date: 2009-06-09
Publication No.: US20100090245A1

Publication Date: 2010-04-15
Inventor: Hung-Yi Lin , Kuan-Jui Huang , Yen-Ting Kung , She-Fen Tien
Applicant: Hung-Yi Lin , Kuan-Jui Huang , Yen-Ting Kung , She-Fen Tien
Priority: TW097139170 20081013
Main IPC: H01L33/00
IPC: H01L33/00 ; H01L21/50

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME

Abstract:

The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

Abstract(Chinese):

本发明的发光二极管封装使用光敏材料来形成荧光体封装或荧光体层，其可以通过批量的半导体工艺制造。此外，通过激光印刷法或透光孔可以准确且容易地控制各个区域中的荧光体的浓度。因此，可以精确地调整发光二极管封装的光学效果。

Public/Granted literature

US08129206B2 Light emitting diode package and method of making the same Public/Granted day:2012-03-06

Information query

Global Dossier Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L33/00	至少有一个电位跃变势垒或表面势垒的专门适用于光发射的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；这些半导体器件的零部件（H01L51/00优先；由在一个公共衬底中或其上形成有多个半导体组件并包括具有至少一个电位跃变势垒或表面势垒，专门适用于光发射的器件入H01L27/15；半导体激光器入H01S5/00）