公开(公告)号：US20120230055A1

公开(公告)日：2012-09-13

申请号：US13270239

申请日：2011-10-11

Applicant: HSIEN-LUNG HO ,  CHIU-HSIUNG LIN ,  KUAN-JUI HUANG

Inventor： HSIEN-LUNG HO ,  CHIU-HSIUNG LIN ,  KUAN-JUI HUANG

IPC: F21V8/00

CPC classification number: G02B6/0031 ,  G02B6/0055

Abstract: A display device includes a display layer and a light guide plate (LGP) arranged on the display layer. The LGP includes a first surface facing away from the display layer, an opposite second surface, and a lateral surface between the first and second surfaces, the lateral surface having a light incident portion. A light source and a scanning mirror are arranged on the lateral surface of the LGP. The light source configured to emit a light beam toward the scanning mirror, the scanning mirror being reciprocally rotatable about a rotating axis at a given frequency, the scanning mirror configured to reflect and direct the light beam from the light source to enter into the LGP through the light incident portion.

Abstract translation: 显示装置包括布置在显示层上的显示层和导光板（LGP）。 LGP包括背离显示层的第一表面，相对的第二表面和在第一和第二表面之间的横向表面，该侧表面具有光入射部分。 光源和扫描镜布置在LGP的侧表面上。 所述光源被配置为朝向所述扫描镜发射光束，所述扫描镜可以以给定频率绕旋转轴线往复转动，所述扫描镜被配置为反射并引导来自所述光源的光束进入所述LGP， 光入射部分。

公开(公告)号：US20120080693A1

公开(公告)日：2012-04-05

申请号：US13313886

申请日：2011-12-07

Applicant: Hung-Yi LIN ,  Kuan-Jui HUANG ,  Yen-Ting KUNG ,  She-Fen TIEN

Inventor： Hung-Yi LIN ,  Kuan-Jui HUANG ,  Yen-Ting KUNG ,  She-Fen TIEN

IPC: H01L33/08

CPC classification number: H01L33/508 ,  H01L24/19 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/48247 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

Abstract translation: 本发明的发光二极管封装使用光敏材料来形成荧光体封装或荧光体层，其可以通过批量的半导体工艺制造。 此外，通过激光印刷法或透光孔可以准确且容易地控制各个区域中的荧光体的浓度。 因此，可以精确地调整发光二极管封装的光学效果。

公开(公告)号：US08129206B2

公开(公告)日：2012-03-06

申请号：US12481549

申请日：2009-06-09

Applicant: Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

Inventor： Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

IPC: H01L33/00

CPC classification number: H01L33/508 ,  H01L24/19 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/48247 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

Abstract translation: 本发明的发光二极管封装使用光敏材料来形成荧光体封装或荧光体层，其可以通过批量的半导体工艺制造。 此外，通过激光印刷法或透光孔可以准确且容易地控制各个区域中的荧光体的浓度。 因此，可以精确地调整发光二极管封装的光学效果。

公开(公告)号：US20090267108A1

公开(公告)日：2009-10-29

申请号：US12481578

申请日：2009-06-10

Applicant: Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

Inventor： Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

IPC: H01L33/00 ,  H01L21/50

CPC classification number: H01L33/486 ,  H01L24/24 ,  H01L24/82 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/24227 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.

Abstract translation: 本发明的LED芯片封装使用半导体基板作为封装基板，从而改善散热。 此外，LED芯片封装结合有平坦化结构，其使得LED芯片和基板成为基本平坦的表面，从而形成平面图案化导电层。 因此，可以通过平面图案化的导电层容易地实现发光二极管芯片之间的串联/并联电连接。

公开(公告)号：US20090064496A1

公开(公告)日：2009-03-12

申请号：US12273550

申请日：2008-11-19

Applicant: Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

Inventor： Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

IPC: H05K3/10

CPC classification number: H01L25/0657 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L2224/14 ,  H01L2224/16237 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract translation: 本发明公开了一种用于连接多个芯片的插入器。 插入器包括连接基板和设置在连接基板中的至少通孔。 连接基板具有第一表面和第二表面。 通孔作为连接器，并且电连接到第一表面和第二表面。 第一表面和第二表面分别电连接至至少第一芯片和第二芯片。 此外，第一芯片和第二芯片通过通孔电连接。

公开(公告)号：US20080146021A1

公开(公告)日：2008-06-19

申请号：US11684646

申请日：2007-03-12

Applicant: Kuan-Jui Huang ,  Jie-Mei Huang ,  Chung-Hsiang Wang

Inventor： Kuan-Jui Huang ,  Jie-Mei Huang ,  Chung-Hsiang Wang

IPC: H01L21/4763

CPC classification number: H01L21/76885

Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

Abstract translation: 一种制造金属互连的方法及其金属间介电层。 通过电镀工艺在衬底上形成设置在其上的第一金属互连图案和第二金属互连图案。 随后，在衬底，第一金属互连图案和第二金属互连图案上形成金属间介电层。 然后将金属间介电层平坦化，并暴露第二金属互连图案。

公开(公告)号：US20060186523A1

公开(公告)日：2006-08-24

申请号：US10907653

申请日：2005-04-11

Applicant: Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

Inventor： Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L2224/05555 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.

Abstract translation: 芯片型微型连接器包括封装基板，设置在封装结构上的微型连接器，多个芯片以及设置在微型连接器和芯片上的盖层。 微连接器包括连接基板，设置在连接基板中的多个连接线，以及暴露在连接基板的表面上并分别连接到每个连接线的多个接触焊盘。 芯片通过接触焊盘和连接线相互耦合。 盖层将微型连接器和芯片封装在封装衬底上。

公开(公告)号：US20060183259A1

公开(公告)日：2006-08-17

申请号：US10906972

申请日：2005-03-15

Applicant: Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

Inventor： Wei-Shun Lai ,  Shu-Hua Hu ,  Kuan-Jui Huang ,  Chin-Chang Pan ,  Yuan-Chin Hsu

IPC: H01L21/00

CPC classification number: B81C1/00365 ,  B81C2201/0132 ,  B81C2201/018 ,  H01L23/3192 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.

Abstract translation: 提供基板。 衬底包括设置在衬底中的多个器件，设置在衬底的表面上并电连接到器件的多个接触焊盘以及位于衬底表面上的表面电介质层。 此后，进行至少包括等离子体蚀刻工艺的表面处理工艺。 随后，至少进行等离子体增强化学气相沉积（PECVD）工艺以在表面电介质层上形成电介质层。 以高频/低频交替方式执行PECVD处理。 接着，形成电介质层上的掩模图案，进行各向异性蚀刻处理，以形成对应于电介质层中的接触焊盘的多个开口。 这些开口暴露接触垫，并且每个开口具有向外倾斜的侧壁。

公开(公告)号：US07795131B2

公开(公告)日：2010-09-14

申请号：US11684646

申请日：2007-03-12

Applicant: Kuan-Jui Huang ,  Jie-Mei Huang ,  Chung-Hsiang Wang

Inventor： Kuan-Jui Huang ,  Jie-Mei Huang ,  Chung-Hsiang Wang

IPC: H01L21/4763

CPC classification number: H01L21/76885

Abstract: A method of fabricating metal interconnects and an inter-metal dielectric layer thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed.

Abstract translation: 一种制造金属互连的方法及其金属间介电层。 通过电镀工艺在衬底上形成设置在其上的第一金属互连图案和第二金属互连图案。 随后，在衬底，第一金属互连图案和第二金属互连图案上形成金属间介电层。 然后将金属间介电层平坦化，并暴露第二金属互连图案。

公开(公告)号：US20100090245A1

公开(公告)日：2010-04-15

申请号：US12481549

申请日：2009-06-09

Applicant: Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

Inventor： Hung-Yi Lin ,  Kuan-Jui Huang ,  Yen-Ting Kung ,  She-Fen Tien

IPC: H01L33/00 ,  H01L21/50

CPC classification number: H01L33/508 ,  H01L24/19 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/48247 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

Abstract translation: 本发明的发光二极管封装使用光敏材料来形成荧光体封装或荧光体层，其可以通过批量的半导体工艺制造。 此外，通过激光印刷法或透光孔可以准确且容易地控制各个区域中的荧光体的浓度。 因此，可以精确地调整发光二极管封装的光学效果。