发明申请
- 专利标题： BONDING APPARATUS AND BONDING METHOD
- 专利标题（中）： 粘接装置和粘接方法
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申请号： US12526730申请日： 2008-02-26
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公开(公告)号： US20100093131A1公开(公告)日： 2010-04-15
- 发明人: Toru Maeda
- 申请人： Toru Maeda
- 申请人地址： JP Tokyo
- 专利权人： SHINKAWA LTD.
- 当前专利权人： SHINKAWA LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007049716 20070228
- 国际申请： PCT/JP2008/053327 WO 20080226
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L21/60 ; B23K3/06 ; B23K1/06 ; B23K20/10
摘要：
A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.
公开/授权文献
- US07743964B2 Bonding apparatus and bonding method 公开/授权日：2010-06-29
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