发明申请
- 专利标题: HIGH DENSITY THREE DIMENSIONAL SEMICONDUCTOR DIE PACKAGE
- 专利标题(中): 高密度三维半导体封装
-
申请号: US12648697申请日: 2009-12-29
-
公开(公告)号: US20100102440A1公开(公告)日: 2010-04-29
- 发明人: Cheemen Yu , Chih-Chin Liao , Hem Takiar
- 申请人: Cheemen Yu , Chih-Chin Liao , Hem Takiar
- 主分类号: H01L25/16
- IPC分类号: H01L25/16 ; H01L23/04
摘要:
A semiconductor package is disclosed including a plurality semiconductor die mounted on stacked and bonded layers of substrate, for example polyimide tape used in tape automated bonding processes. The tape may have a plurality of repeating patterns of traces and contact pads formed thereon. The traces each include aligned interconnect pads on the respective top and bottom surfaces of the substrate for bonding the traces of one pattern to the traces of another pattern after the patterns have been singulated from the substrate, aligned and stacked. Semiconductor die such as flash memory and a controller die are mounted on the traces of the respective patterns on the substrate. In order for the controller die to uniquely address a specific flash memory die in the stack, a group of traces on each substrate supporting the memory die are used as address pins and punched in a unique layout relative to the layout of the traces other substrates. By providing each flash memory semiconductor die on a substrate with a unique layout of address traces, each memory die may be selectively addressed by the controller die.
公开/授权文献
- US08653653B2 High density three dimensional semiconductor die package 公开/授权日:2014-02-18
信息查询
IPC分类: