Invention Application
US20100109691A1 Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance 有权
薄型探头具有改进的机械磨擦和降低的接触电感

  • Patent Title: Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
  • Patent Title (中): 薄型探头具有改进的机械磨擦和降低的接触电感
  • Application No.: US12684272
    Application Date: 2010-01-08
  • Publication No.: US20100109691A1
    Publication Date: 2010-05-06
  • Inventor: January Kister
  • Applicant: January Kister
  • Applicant Address: US CA Carlsbad
  • Assignee: MicroProbe, Inc.
  • Current Assignee: MicroProbe, Inc.
  • Current Assignee Address: US CA Carlsbad
  • Main IPC: G01R1/06
  • IPC: G01R1/06
Low Profile Probe Having Improved Mechanical Scrub and Reduced Contact Inductance
Abstract:
A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.
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