An interconnector includes a strip-shaped and electrically conductive member electrically connecting respective electrodes of adjacent solar cells, the conductive member includes a plurality of planar stress relief parts and the stress relief parts are formed at equal pitches. With this structure, a stress due to a difference in thermal expansion coefficient between the interconnector and the solar cell is uniformly alleviated, so that the warp occurring to the solar cell is reduced and the reliability of the connection between the interconnector and the solar cell is improved.