Invention Application
- Patent Title: SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT
- Patent Title (中): 半导体芯片和无线电频率电路
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Application No.: US12527877Application Date: 2007-11-15
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Publication No.: US20100117711A1Publication Date: 2010-05-13
- Inventor: Takuya Suzuki , Kenji Kawakami , Ko Kanaya , Yoichi Kitamura
- Applicant: Takuya Suzuki , Kenji Kawakami , Ko Kanaya , Yoichi Kitamura
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Priority: JP2007-093472 20070330
- International Application: PCT/JP07/72211 WO 20071115
- Main IPC: G06F7/44
- IPC: G06F7/44 ; H01L23/48
Abstract:
A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.
Public/Granted literature
- US08548416B2 Semiconductor chip and radio frequency circuit Public/Granted day:2013-10-01
Information query
