发明申请
US20100119730A1 APPARATUS AND METHOD FOR FORMING A THIN FILM ELECTRONIC DEVICE ON A THERMOFORMED POLYMERIC SUBSTRATE
审中-公开
在热成型聚合物基板上形成薄膜电子器件的装置和方法
- 专利标题: APPARATUS AND METHOD FOR FORMING A THIN FILM ELECTRONIC DEVICE ON A THERMOFORMED POLYMERIC SUBSTRATE
- 专利标题(中): 在热成型聚合物基板上形成薄膜电子器件的装置和方法
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申请号: US12597198申请日: 2008-06-05
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公开(公告)号: US20100119730A1公开(公告)日: 2010-05-13
- 发明人: Brian K. Nelson , David L. Philips , Donald J. McClure , Daniel H. Carlson , James N. Dobbs , Scott M. Schnobrich , Daniel J. Theis
- 申请人: Brian K. Nelson , David L. Philips , Donald J. McClure , Daniel H. Carlson , James N. Dobbs , Scott M. Schnobrich , Daniel J. Theis
- 国际申请: PCT/US08/65836 WO 20080605
- 主分类号: B05C9/14
- IPC分类号: B05C9/14 ; H05B6/46
摘要:
An apparatus and method for fabricating electronic devices on a polymeric substrate provide for positionally constraining a polymer substrate on a platen, and heating the constrained polymer substrate to at least a glass transition temperature of the polymer substrate. A heat processable ink is applied to the constrained polymer substrate to form at least a portion of a layer of an electronic device thereon.
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