发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND MEMORY CARD USING THE SAME
- 专利标题（中）： 半导体器件和使用其的存储卡
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申请号： US12693096申请日： 2010-01-25
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公开(公告)号： US20100120203A1公开(公告)日： 2010-05-13
- 发明人: Takashi OKADA , Kiyokazu OKADA , Akinori ONO , Taku NISHIYAMA
- 申请人： Takashi OKADA , Kiyokazu OKADA , Akinori ONO , Taku NISHIYAMA
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-098271 20060331; JP2006-277884 20061011
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/56
摘要：
A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.
公开/授权文献
- US08110434B2 Semiconductor device and memory card using the same 公开/授权日：2012-02-07