A socket for electrically connecting an IC package to a printed circuit board, comprises an insulative housing, a stiffener surrounding the housing and having a front wall defining a hole; and a load plate pivotably mounted to the front wall of the stiffener. The load plate has a pivotal portion with a hook, the hook has a latching finger engaging with the latching hole of the stiffener, a protruding finger and a gap defined between the latching finger and the protruding finger. The protruding finger resists the stiffener when the load plate deflects on a top-to-bottom direction relative to the stiffener. The protruding finger also can engage with the stiffener to guide the load plate to rotate in a correct direction.