发明申请
- 专利标题： ASSEMBLING STRUCTURE OF RADIO IC TAG
- 专利标题（中）： 组装无线IC标签的结构
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申请号： US12608194申请日： 2009-10-29
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公开(公告)号： US20100123010A1公开(公告)日： 2010-05-20
- 发明人: Isao SAKAMA
- 申请人： Isao SAKAMA
- 申请人地址： JP Tokyo
- 专利权人： HITACHI, LTD.
- 当前专利权人： HITACHI, LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-296407 20081120
- 主分类号： G06K19/07
- IPC分类号： G06K19/07
摘要：
In an assembling structure of a radio IC tag, the radio IC tag includes an IC chip for recording information therein and a first antenna connected to the IC chip for wirelessly transmitting or receiving information. The first antenna has a first gap for performing impedance matching. A conductive second antenna having a second gap is arranged over the IC chip, the first gap, and the first antenna.
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